New partnership between NXP Semiconductors and ithinx

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i.MX 93 Evaluation board with ithinx SOM
i.MX 93 Evaluation board with ithinx SOM
i.MX 93 Evaluation board with ithinx SOM
i.MX 93 Evaluation board with ithinx SOM

ithinx partners with NXP Semiconductors to create a high-performance wireless platform to enable swifter IoT gateway development

New platform including evaluation kit, system on module and gateway across multiple protocols, to aid rapid IoT gateway development.

April 9, 2024 COLOGNE, April 9, 2024 — ithinx GmbH today announced the iXpro platform consisting of a System on Module and gateway to help assist customers create IoT solutions quickly and more cost effectively.

Since 2016, ithinx has served its core customers of predominantly European, medium sized enterprises, as well as its owner Viessmann Climate Solutions, with IoT engineering services. After multiple projects developing IoT gateways from scratch, based on individually defined requirements, it became clear to ithinx that some common denominators could be identified. Furthermore, by creating a standard basis for a number of IoT use cases, the investment required by each separate organization could be reduced, thus increasing feasibility for a number of new business cases.

On this basis, ithinx has launched two new developments in collaboration with NXP® Semiconductors.

iXpro System on Module

ithinx has developed a strong reputation for compact layout designs, and in particular, the high-performance PCB antenna design that is based on a patented methodology (EP3 893 329 A1).  Starting with the NXP i.MX 93 Evaluation kit (MCIMX93-EVKCM) as a basis, ithinx has modified the System on Module (SoM) board that contains i.MX 93 applications processor and its accessories, such as the NXP PCA9451A power management ICoptimized for the i.MX 93 SoC, 16-bit LPDDR4X and eMMC, to include NXP’s IW612 tri-radio chip to provide wireless connectivity with a Multi RF solution along with organic antennas to support WLAN IEEE 802.11 b/g/n/ac/ax, Low Power Radio IEEE 802.15.4 (Zigbee, Thread), IEEE 802.15.1 (Bluetooth® Classic and Bluetooth LE).

The SOM, complete with a board support package, allows developers to create their own IoT gateway application and then seamlessly transfer it to their final product, using the iXpro Gateway as its basis.

“The optimized blend of performance and power delivered by NXP’s i.MX 93 applications processors, complemented by the advanced connectivity capabilities of the IW612, enable an advanced IoT gateway solution designed to accelerate edge processing across industrial and IoT applications. Combining the advantages of the i.MX 93 applications processor with ithinx’s expertise in antenna and layout design will help our European customers get to market faster.”
– Charles Dachs, Senior Vice President and General Manager, Industrial and IoT Edge, NXP Semiconductors. 

 

Wireless connectivity with the iXpro System-on-Module

Use the combination of the edge intelligence of the i.MX 93 evaluation kit (MCIMX93-EVKCM) from NXP Semiconductors with our System-on-Module as an optimal basis for your IoT development.

iXpro Gateway

The iXpro combines multiple protocols (WLAN IEEE 802.11 b/g/n/ac/ax, Low Power Radio IEEE 802.15.4 (Zigbee, Thread), IEEE 802.15.1 (Bluetooth Classic and Bluetooth LE) and LTE CAT1bis with GNSS) with easy integration through multiple physical interfaces. This, with the addition of being able to upgrade the gateway to being Matter-ready, means the gateway can serve a number of alternative use cases in the IoT.

Designed for speed to market, it comes equipped with patented integrated antenna technology, ensuring both performance and cost-effectiveness.

Furthermore, the board offers a Linux OS with a Board Support Package included, ensuring robust security and stability. And with wireless drivers guaranteed for over a decade, it provides a lasting basis for IoT products.

Both products will be demonstrated on the ithinx stand at the Embedded World 2024 (Stand 3-620), and ready for deployment by the end of the year.

“We’ve been working closer with NXP and I’m delighted that the collaboration is bearing fruit. Our new iXpro products using NXP Semiconductors’ chips, combine NXP Semiconductors’ global expertise with our local support in terms of IoT engineering for the European market. I’m sure this will provide a fantastic basis for many new IoT business cases in the future”
– Jens Binder, Managing Director (ithinx) 

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About ithinx

ithinx GmbH combines over 100 years of tradition with the innovative strength of a young company. As a subsidiary of the international Viessmann Climate Solutions, ithinx develops connectivity solutions in agile teams in Cologne and Duisburg and combines individual IoT solutions with the experience of successful and proven series systems. ithinx provides a creative part of their customers’ digital transformation.

Viessmann Climate Solutions, in turn, is part of Carrier Global Corporation, the leading provider of healthy, safe, sustainable and intelligent building and cold chain solutions.

Find out more about ithinx

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