iXbase Stamp – for rapidly developed Wi-Fi and BLE devices
Stamp module with Wi-Fi 6 & BLE 5.4 for rapidly developed and certified OEM platforms
Stamp module with Wi-Fi 6 & BLE 5.4 for rapidly developed and certified OEM platforms
The development of networked devices is complex today: radio modules must simultaneously meet performance, security, certifiability and series production requirements. Without a suitable foundation, the effort and risk for manufacturers of networked industrial devices increase significantly.
Our iXbase Stamp offers a certifiable connectivity basis that reduces complexity and allows you to focus on application logic and system integration. The pre-certified module with integrated Wi-Fi and Bluetooth Low Energy combines modern wireless standards with industrial security architecture and enables efficient product certification.
Why iXbase Stamp:
With iXbase Stamp, OEMs can make their product development faster, more secure and more efficient – from the initial idea to series production.
The module can be used flexibly. This architecture makes the iXbase Stamp a scalable radio module for embedded systems and a flexible module for integration into your own hardware.
Operation as a standalone application controller including Wi-Fi and BLE connectivity
Use as a dedicated communication module in conjunction with an external host MCU
Are you planning a new OEM platform or want to put your existing architecture on a scalable connectivity basis? Our iXbase Stamp offers you a powerful, secure and pre-certified WLAN/BLE module for professional product development.
Smart functions for connected industrial products
The iXbase Stamp supports:
By integrating it into larger ithinx system solutions, the module can also be used as part of a holistic IoT architecture – from IoT communication module to complete device platform.
The iXbase Stamp module covers a wide range of applications – from industrial control systems to smart home and HVAC products. Thanks to its stable semiconductor base and industrial design, it is ideal for long-term, scalable product platforms.
| Specification | Details |
|---|---|
| Processor / MCU | ARM Cortex-M33 up to 160 MHz |
| Wireless technologies | Dual-band Wi-Fi 2.4 GHz & 5 GHz (802.11 b/g/n/ax), BLE 5.4 |
| Antennas | On-board PCB or u.FL connector |
| Design | 27.5 × 18 mm |
| Voltage | 3.0 – 3.6 V single supply |
| Operating temperature | -40 °C to +85 °C |
| Security modules | ARM TrustZone, HSM with crypto acceleration, secure boot |
| Update / Encryption | OTA updates, on-the-fly flash decryption |